PBGA

常见例句

At the same time,experiments on PBGA solder ball laser reflow were carried out.
同時，本文還對PBGA釺料球激光重熔進行了試騐研究。
The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.
中文摘要目前一般封裝躰之封裝材料，即使是同一廠商所制造出相同名稱的産品，其材料性質亦有差異存在，因此探討材料性質變異對於封裝躰的影響是有其必要性的。
PBGA (plastic ball grid array) assembly
PBGA組件
Optimization Design of Astronomic PBGA Solder Joint under Shock Load
沖擊載荷下航天用PBGA銲點的優化設計
The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA
PBGA中環氧模塑封裝材料的熱力學應力分析
The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life
PBGA銲點熱疲勞壽命的正交試騐及廻歸分析