ultrasonic bonding
基本解释
- [机] 超声焊接
英汉例句
- Pitching vibration of ultrasonic bonding transducer can affect the bonding quality of IC.
以超声键合换能系统为研究对象，分析了其俯仰振动对超声键合质量的影响。 - The characteristics of bonding force in the ultrasonic bonding process were also studied.
在超声引线键合过程中，键合压力是影响键合强度的重要因素之一。 - Aluminum wire ultrasonic bonding; transducer drive current; signal time-frequency analysis; feature selecting; quality online monitoring.
粗铝丝超声引线键合； 换能器驱动电流； 信号时频分析； 特征提取； 质量在线监测。
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双语例句
词组短语
- ultrasonic wire bonding 超音波引线压接;超声引线键合;超音波引线压接机
- ultrasonic ball bonding 键合工艺
- Ultrasonic fusion bonding 超声波熔融键合
- ultrasonic wedge bonding 超声楔焊
- ultrasonic thermo -bonding 超声波热粘合
短语
专业释义
- 超声键合
Nowadays, ultrasonic bonding, which including wire bonding and thermosonic flip chip bonding, are the main packaging processes for manufacturing semiconductor products.
当前,包括单点引线与多点倒装的超声键合构成半导体器件的主要封装形式。 - 超声波粘合
- 超声波键合
- 超声波结合
- 超声键合
The frequency spectrums of force response were obtained through output force signals of dynamic force sensor. These experiment phenomena and results are helpful to studied on bonding parameters matching and optimization in ultrasonic bonding.
利用压力传感器输出压力响应信号，得到压力响应曲线的频谱图，实验分析键合压力参数对超声功率参数的匹配，对今后超声键合过程参数的匹配及优化具有一定的指导意义。 - 超声波粘合
- 超声波焊接
- 超声（波）焊接（法）
- 超音波结合
- 超声引线键合
- 超声焊接
- 超音波焊接